? semiconductor components industries, llc, 2012 may, 2012 ? rev. 5 1 publication order number: cm2009/d cm2009 vga port companion circuit product description the cm2009 connects between a video graphics controller embedded in a pc, graphics adapter card or set top box and the vga or dvi ? i port connector. the cm2009 incorporates esd protection for all signals, level shifting for the ddc signals and buffering for the sync signals. esd protection for the video, ddc and sync lines is implemented with low ? capacitance current steering diodes. all esd diodes are designed to safely handle the high current spikes specified by iec ? 61000 ? 4 ? 2 level 4 ( 8 kv contact discharge if c byp is present, 4 kv if not). the esd protection for the ddc signal pins are designed to prevent ?back current? when the device is powered down while connected to a monitor that is powered up. separate positive supply rails are provided for the video, ddc and sync channels to facilitate interfacing with low voltage video controller ics to provide design flexibility in multi ? supply ? voltage environments. two non ? inverting drivers provide buffering for the hsync and vsync signals from the video controller ic (sync1, sync2). these buffers accept ttl input levels and convert them to cmos output levels that swing between ground and v cc_sync , which is typically 5 v. additionally, each driver has a series termination resistor (r t ) connected to the sync_out pin, eliminating the external termination resistors typically required for the hsync and vsync lines of the video cable. there are three versions with different values of r t to allow termination at typically 65 (cm2009 ? 00) or 15 (cm2009 ? 02). the 15 (cm2009 ? 02) version will typically require two external resistors which can be chosen to exactly match the characteristic impedance of the sync lines of the video cable. two n ? channel mosfets provide the level shifting function required when the ddc controller is operated at a lower supply voltage than the monitor. the gate terminals for these mosfets (v cc_ddc ) should be connected to the supply rail (typically 3.3 v) that supplies power to the transceivers of the ddc controller. features ? includes esd protection, level ? shifting, buffering and sync impedance matching ? 7 channels of esd protection for all vga port connector pins meeting iec ? 61000 ? 4 ? 2 level 4 esd requirements ( 8 kv contact discharge) ? very low loading capacitance from esd protection diodes on video lines (4 pf maximum) ? 5 v drivers for hsync and vsync lines ? integrated impedance matching resistors on sync lines ? bi ? directional level shifting n ? channel fets provided for ddc_clk & ddc_data channels ? backdrive protection on ddc lines ? compact 16 ? lead qsop package ? these devices are pb ? free and are rohs compliant applications ? vga and dvi ? i ports in: ? desktop and notebook pcs ? graphics cards ? set top boxes marking diagram device package shipping ? ordering information http://onsemi.com cm2009 ? 00qr qsop ? 16 (pb ? free) 2500/tape & reel qsop16 qr suffix case 492 ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specification brochure, brd8011/d. cm2009 0xqr = specific device code yy = year ww = work week cmd yyww cm2009 0xqr qsop ? 16 (pb ? free) cm2009 ? 02qr 2500/tape & reel
cm2009 http://onsemi.com 2 simplified electrical schematic video_1 video_2 video_3 v cc_video gnd sync_out2 gnd v cc_ddc v cc_sync sync_out1 sync_in2 sync_in1 ddc_in2 ddc_in1 r t 3 4 5 6 10 11 13 15 1 8 2 14 16 ddc_out2 ddc_out1 12 9 byp r t 7 package / pinout diagram top view 16 pin qsop v cc_sync 1 2 3 4 5 6 7 8 10 9 11 12 13 14 15 16 video_1 video_2 video_3 gnd v cc_ddc byp sync_in2 sync_out1 sync_out2 sync_in1 ddc_out2 ddc_in2 ddc_in1 ddc_out1 v cc_video table 1. pin descriptions lead(s) name description 1 v cc_sync this is an isolated supply input for the sync_1 and sync_2 level shifters and their associated esd protection circuits. 2 v cc_video this is a supply pin specifically for the video_1, video_2 and video_3 esd protection circuits. 3 video_1 video signal esd protection channel. this pin is typically tied one of the video lines between the vga controller device and the video connector. 4 video_2 video signal esd protection channel. this pin is typically tied one of the video lines between the vga controller device and the video connector. 5 video_3 video signal esd protection channel. this pin is typically tied one of the video lines between the vga controller device and the video connector. 6 gnd ground reference supply pin. 7 v cc_ddc this is an isolated supply input for the ddc_1 and ddc_2 level ? shifting n ? fet gates. 8 byp this input is used to connect an external 0.2 f bypass capacitor to the ddc circuits, resulting in an increased esd withstand voltage rating for these circuits ( 8 kv with vs. 4 kv without). 9 ddc_out1 ddc signal output. connects to the video connector side of one of the sync lines. 10 ddc_in1 ddc signal input. connects to the vga controller side of one of the sync lines.
cm2009 http://onsemi.com 3 table 1. pin descriptions lead(s) description name 11 ddc_in2 ddc signal input. connects to the vga controller side of one of the sync lines. 12 ddc_out2 ddc signal output. connects to the video connector side of one of the sync lines. 13 sync_in1 sync signal buffer input. connects to the vga controller side of one of the sync lines. 14 sync_out1 sync signal buffer output. connects to the video connector side of one of the sync lines. 15 sync_in2 sync signal buffer input. connects to the vga controller side of one of the sync lines. 16 sync_out2 sync signal buffer output. connects to the video connector side of one of the sync lines. specifications table 2. absolute maximum ratings parameter rating units v cc_video, v cc_ddc and v cc_sync supply voltage inputs [gnd ? 0.5] to +6.0 v esd diode forward current (one diode conducting at a time) 10 ma dc voltage at inputs video_1, video_2, video_3 ddc_in1, ddc_in2 ddc_out1, ddc_out2 sync_in1, sync_in2 [gnd ? 0.5] to [v cc_video + 0.5] [gnd ? 0.5] to 6.0 [gnd ? 0.5] to 6.0 [gnd ? 0.5] to [v cc_sync + 0.5] v operating temperature range ? 40 to +85 c storage temperature range ? 40 to +150 c package power rating (t a = 25 c) 500 mw stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability.
cm2009 http://onsemi.com 4 table 3. electrical operating characteristics (note 1) symbol parameter conditions min typ max units i cc_video v cc_video supply current v cc_video = 5.0 v; video inputs at v cc_video or gnd 10 a i cc_ddc v cc_ddc supply current v cc_ddc = 5.0 v 10 a i cc_sync v cc_sync supply current v cc_sync = 5 v; sync inputs at gnd or v cc_sync ; sync outputs unloaded 50 a v cc_sync = 5 v; sync inputs at 3.0 v; sync outputs unloaded 2.0 ma v f esd diode forward voltage i f = 10 ma 1.0 v v ih logic high input voltage v cc_sync = 5.0 v; (note 2) 2.0 v v il logic low input voltage v cc_sync = 5.0 v; (note 2) 0.6 v v oh logic high output voltage i oh = 0 ma, v cc_sync = 5.0 v; (note 2) 4.85 v v ol logic low output voltage i ol = 0 ma, v cc_sync = 5.0 v; (note 2) 0.15 v r out sync driver output resistance (cm2009 ? 00 only) v cc_sync = 5.0 v; sync inputs at gnd or 3.0 v 65 r out sync driver output resistance (cm2009 ? 02 only) v cc_sync = 5.0 v; sync inputs at gnd or 3.0 v; (note ?) 15 v oh ? 02 logic high output voltage (cm2009 ? 02 only) i oh = 24 ma; v cc_sync = 5.0 v; (note 2) 2.0 v v ol ? 02 logic low output voltage (cm2009 ? 02 only) i ol = 24 ma; v cc_sync = 5.0 v; (note 2) 0.8 v i in input current video inputs v cc_video = 5.0 v; v in = v cc_video or gnd 1 a sync_in1, sync_in2 inputs v cc_sync = 5.0 v; v in = v cc_sync or gnd 1 a i off level shifting n ? mosfet ?off? state leakage current (v cc_ddc ? v ddc_in ) 0.4 v; v ddc_out = v cc_ddc 10 a (v cc_ddc ? v ddc_out ) 0.4 v; v ddc_in = v cc_ddc 10 a v on voltage drop across level ? shifting n ? mosfet when ?on? v cc_ddc = 2.5 v; v s = gnd; i ds = 3 ma; 0.18 v c in_vid video input capacitance v cc_video = 5.0 v; v in = 2.5 v; f = 1 mhz; (note 4) 4 pf v cc_video = 2.5 v; v in = 1.25 v; f = 1 mhz; (note 4) 4.5 pf t plh sync driver l => h propagation delay c l = 50 pf; v cc = 5.0 v; input t r and t f 5 ns 12 ns t phl sync driver h => l propagation delay c l = 50 pf; v cc = 5.0 v; input t r and t f 5 ns 12 ns t r, t f sync driver output rise & fall times c l = 50 pf; v cc = 5.0 v; input t r and t f 5 ns 4 ns v esd esd withstand voltage v cc_video = v cc_sync = 5 v; (notes 3, 4 & ?) 8 kv 1. all parameters specified over standard operating conditions unless otherwise noted. 2. these parameters apply only to the sync drivers. note that r out = r t + r buffer . 3. per the iec ? 61000 ? 4 ? 2 international esd standard, level 4 contact discharge method. byp, v cc_video and v cc_sync must be bypassed to gnd via a low impedance ground plane with a 0.2 f, low inductance, chip ceramic capacitor at each supply pin. esd pulse is applied between the applicable pins and gnd. esd pulses can be positive or negative with respect to gnd. applicable pins are: video_1, video_2, video_3, sync_out1, sync_out2, ddc_out1 and ddc_out2. all other pins are esd protected to the industry standard 2 kv human body model (mil ? std ? 883, method 3015). the bypass capacitor at the byp pin may optionally be omitted, in which case the max. esd withstand voltage for the ddc_out1 and ddc_out2 pins is reduced to 4 kv. 4. the sync_out pins on the cm2009 ? 02 are guaranteed for 2 kv hbm esd protection.
cm2009 http://onsemi.com 5 application information figure 1. typical application connection diagram notes: 1. the cm2009 should be placed as close to the vga or dvi ? i connector as possible. 2. the esd protection channels video_1, video_2, video_3 may be used interchangeably between the r, g, b signals. 3. if differential video signal routing is used, the red, blue, and green signal lines should be terminated with external 37.5 resistors. 4. ?vf? are external video filters for the rgb signals. 5. supply bypass capacitors c1 and c2 must be placed immediately adjacent to the corresponding vcc pins. connections to the vcc pins and ground plane must be made with minimal length copper traces (preferably less than 5 mm) for best esd protection. 6. the bypass capacitor for the byp pin has been omitted in this diagram. this results in a reduction in the maximum esd withstand voltage at the ddc_out pins from 8 kv to 4 kv. if 8 kv esd protection is required, a 0.2 f ceramic bypass capacitor should be connected between byp and ground. 7. the sync buffers may be used interchangeably between hsync and vsync. 8. the emi filters at the sync_out and ddc_out pins (c5 to c12, and ferrite beads fb1 to fb4) are for reference only. the component values and filter configuration may be changed to suit the application. 9. the ddc level shifters ddc_in, ddc_out, may be used interchangeably between ddca_clk and ddca_data. 10. r1, r2 are optional. they may be used, if required, to pull the ddc_clk and ddc_data lines to vcc_5v when no monitor is connected to the vga connector. if used, it should be noted that ?back current? may flow between the ddc pins and vcc_5v via these resistors when vcc_5v is powered down. 11. for optimal esd performance with the cm2009 ? 02, an additional clamp device (such as the cmd pacdn042) should be placed on hsync/vsync lines between the external matching resistor and the vga connector.
cm2009 http://onsemi.com 6 package dimensions qsop16 case 492 issue a e m 0.25 c a1 a2 c detail a detail a h x 45 dim max min inches a 0.053 0.069 b 0.008 0.012 l 0.016 0.050 e 0.025 bsc h 0.009 0.020 c 0.007 0.010 a1 0.004 0.010 m 0 8 notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: millimeters. 3. dimension b does not include dambar protrusion. 4. dimension d does not include mold flash, protrusions, or gate burrs. mold flash, protrusions, or gate burrs shall not exceed 0.005 per side. dimension e1 does not include interlead flash or protrusion. interlead flash or protrusion shall not exceed 0.005 per side. d and e1 are determined at datum h. 5. datums a and b are determined at datum h. b l 6.40 16x 0.42 16x 1.12 0.635 dimensions: millimeters 16 pitch soldering footprint 9 18 d d 16x seating plane 0.10 c e1 a a-b d 0.20 c e 18 16 9 16x c m d 0.193 bsc e 0.237 bsc e1 0.154 bsc l2 0.010 bsc d 0.25 c d b 0.20 c d 2x 2x 2x 10 tips 0.10 c h gauge plane c a2 0.049 ---- 1.35 1.75 0.20 0.30 0.40 1.27 0.635 bsc 0.22 0.50 0.19 0.25 0.10 0.25 0 8 4.89 bsc 6.00 bsc 3.90 bsc 0.25 bsc 1.24 ---- max min millimeters l2 a seating plane on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. cm2009/d publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
|
